Femtosecond Lasers for Unmatched Micromachining - Asia Pacific Metalworking Equipment News | Manufacturing | Automation | Quality Control
Development of Laser Cutting and Joining Processing
Recast Layer - an overview | ScienceDirect Topics
Quality Analysis of Pulsed Laser Cutting of Superalloy Sheet | Scientific.Net
Untitled Document
Ultrafast laser processing of materials: a review
Heat-Treatment Influence on Recast-Layer Thickness from Nonconventional Machining | 2020-04-03 | Industrial Heating
Dynamic change process of a recast layer in Nd:YAG millisecond laser trepan drilling
Development of Laser Cutting and Joining Processing
Surface integrity in wire-EDM tangential turning of in situ hybrid metal matrix composite A359/B4C/Al2O3
Coatings | Free Full-Text | Surface Texturing of CVD Diamond Assisted by Ultrashort Laser Pulses | HTML
Recast Layer - an overview | ScienceDirect Topics
High precision and high aspect ratio laser drilling: challenges and solutions
Backscatter micrograph of a laser drilling induce recast, oxide,... | Download Scientific Diagram
Untitled Document
Dynamic change process of a recast layer in Nd:YAG millisecond laser trepan drilling
Heat-Treatment Influence on Recast-Layer Thickness from Nonconventional Machining | 2020-04-03 | Industrial Heating
![Laser cutting material removal mechanism [6]. | Download Scientific Diagram](https://www.researchgate.net/profile/Pedram-Parandoush/publication/273839638/figure/fig1/AS:512844761440256@1499283127350/Laser-cutting-material-removal-mechanism-6.png "Laser cutting material removal mechanism [6]. | Download Scientific Diagram")
Laser cutting material removal mechanism [6]. | Download Scientific Diagram
Microstructures showing recast layer and HAZ in laser drilled 8 mm... | Download Scientific Diagram
Experimental Investigation of Multiple Quality Characteristics of Laser Beam Machined Surface using Integrated Taguchi and Fuzzy Logic Method
Cutting Properties of Austenitic Stainless Steel by Using Laser Cutting Process without Assist Gas
US9287175B2 - Fabrication method for dicing of semiconductor wafers using laser cutting techniques - Google Patents
![Laser fusion cutting sketch [8]. | Download Scientific Diagram](https://www.researchgate.net/profile/David-Suarez-Eiroa/publication/316172495/figure/fig3/AS:484253910736898@1492466537468/Laser-fusion-cutting-sketch-8.png "Laser fusion cutting sketch [8]. | Download Scientific Diagram")
Laser fusion cutting sketch [8]. | Download Scientific Diagram
